GC G-Premio Bond | 8th Generation Bonding Agent | Non-HEMA

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SKU: AMGC094 Categories: , , , Tags: , , Brand:


GC G-Premio BOND
G-Premio BOND is a universal, 8th generation bonding agent that is compatible with total-etch, self-etch and selective etch techniques providing excellent versatility. It is perfectly adapted to all direct restorations and can also be used to repair indirect restorations without the use of primer. G-Premio BOND can also be used in combination with a silane when repairing glass or hybrid ceramic and is also ideal for hypersensitivity. It is available in a bottle (5 mL) with a new silicone cover to enable more precise drop dispensing.
Outstanding performance with all etching modes and in all clinical situations.
A unique combination of three functional monomers (4-MET, MDP and MDTP), notably excluding HEMA, ensures excellent stability and exceptional bond strengths not just to tooth tissue but to all indirect substrates, including composites, precious and non-precious metals, zirconia and alumina for all repair cases.
Low pH (1.5) provides effective and consistent bonding
Use in all total-etch, self-etch and selective etch bonding techniques
Low film thickness (3 microns) enables use with resin cements to bond indirect restorations
Universal (8th generation) bonding agent for use in direct and indirect procedures and treatment of hypersensitivity
Up to 5 minutes working time
Consistent bond strength with easy application
Better dispensing control and less waste with new silicone bottle design.
Fast technique (10 second placement and 25 seconds before placing composite)




Zero debondings:
High & durable bond to tooth structure and indirect substrates thanks to 3 functional monomers
Zero discolorations:
Extremely thin film thickness (3µm) and strong bonding layer with high filler content
Zero post-operative sensitivity:
Dentin tubules are sealed in all etching modes
Zero mistakes:
Clear procedure and very low technique-sensitivity

KEY Specifications

Store at room temperature (1-25°C) (33.8-77.0°F)

Directions To USE

How to Use:

Leave undisturbed for 10 seconds after application. Dry thoroughly for 5 seconds under MAXIMUM air pressure and light cure for 10 seconds. For the selective etching approach, apply 35% – 40% phosphoric acid on enamel for 10 seconds prior to the application of the bonding.
Application Time:

30 seconds from application time to light-cure
Bonding Layer Thickness: Less than 3 µM


1 X 5ML Bottle